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Low Profile Dip and SIP Socket
Description

Low Profile Dip and SIP Socket

  • Open insulator with ladder construction.
  • Very low-profile; as low as .098 (2.50) above PCB.
  • Open insulator with ladder construction.
  • Sockets are XY stackable.
  • DIP configuration available in 6 - 64 positions.
  • SIP configuration available in 2 - 64 positions.
  • SIP sockets break-away into any configuration.
  • Machined outer sleeve with BeCu inner contact.
  • Socket pins feature closed-end construction eliminating any solder wicking problems.
  • Socket pins available in a wide variety of styles and plating options.
  • Packaged in tubes compatible with automatic insertion equipment. (DIP only)

 

SIP SOCKET PART NUMBER

NUMBER OF PINS

DIMENSIONS (See Fig. 1)

  

A

B

C

D

UXO306XXXXX

6

.300 (7.62)

.400 (10.16)

.300 (7.62)

.093 (2.36)

UXO308XXXXX

8

.400 (10.16)

.400 (10.16)

.300 (7.62)

.093 (2.36)

UXO314XXXXX

14

.700 (17.78)

.400 (10.16)

.300 (7.62)

.093 (2.36)

UXO316XXXXX

16

.800 (20.32)

.400 (10.16)

.300 (7.62)

.093 (2.36)

UXO318XXXXX

18

.900 (22.86)

.400 (10.16)

.300 (7.62)

.093 (2.36)

UXO320XXXXX

20

1.000 (25.40)

.400 (10.16)

.300 (7.62)

.093 (2.36)

UXO422XXXXX

22

1.100 (27.94)

.500 (12.70)

.400 (10.16)

.093 (2.36)

UXO324XXXXX

24

1.200 (30.48)

.400 (10.16)

.300 (7.62)

.093 (2.36)

UXO624XXXXX

24

1.200 (30.48)

.700 (17.78)

.600 (15.24)

.093 (2.36)

UXO328XXXXX

28

1.400 (35.56)

.400 (10.16)

.300 (7.62)

.125 (3.18)

UXO628XXXXX

28

1.400 (35.56)

.700 (17.78)

.600 (15.24)

.093 (2.36)

UXO632XXXXX

32

1.600 (40.64)

.700 (17.78)

.600 (15.24)

.125 (3.18)

UXO640XXXXX

40

2.000 (50.80)

.700 (17.78)

.600 (15.24)

.093 (2.36)

UXO648XXXXX

48

2.400 (60.96)

.700 (17.78)

.600 (15.24)

.093 (2.36)

UXO964XXXXX

64

3.200 (81.28)

1.000 (25.40)

.900 (22.86)

.093 (2.36)

Special

 

SIP SOCKET
PART NUMBER

NUMBER OF PINS

DIMENSION F (See Fig. 2)

SXO020XXXXX

20

2.000 (50.80)

SXO032XXXXX

32

3.200 (81.28)

SXO064XXXXX

64

6.400 (162.56)

 

FIG 1FIG 2
ulo-10-1.jpg (53230 octets)ulo-10-2.jpg (35291 octets)

 

Fig 3 : XLO(3161)Fig 4 : XNO(3000)Fig 5 : XNO(3208)
xlo-10.jpg (36702 octets)

E=.097[2.47]

uso-5-2.jpg (45750 octets)

E3000=.125[3.18]

xno-10.jpg (40751 octets)

E3208=.115[2.91]

 

ORDERING INFORMATION

ULO

3

18

TL

A

31

Series

DIP Spacing

Pin Number

Plating 0f Sleeve

Loose Pin Number

Plating of Inner Contact

SLO

0 - strip socket only 

TL - Tin Lead 200µ" (5.08µm)

Solder Tail Length

30 - GoId 10µ" (0.25µm)

ULO

3 - .300 (7.62) centers

 

TB - Tin Lead 150µ" (3.80µm)

See Fig 3, 4 & 5

31 - GoId 30µ" (0.75µm)

ULO

4 - .400 (10.16) centers

 

GH - GoId lOµ" (0.25µm)

(E Dim.)...........Pin

36 - Tin Lead 200µ"(5.08µm)

ULO

6 - .600 (15.24) centers

 TF- Tin 200µ" (5.08µm)G - .097 (2.47)
(ULO-SLO only) . . . . . 3161

36F - Tin Lead 200µ"(5.08µm) with lubricant

ULO9 - .900 (22.86) centers  H - .111 (2.82)
(UMO-SMO only) . . . . 3000
34F - Tin 200µ"(5.08µm) with lubricant
    A - .115 (2.91)
(ULO-SLO only) . . ... . 3176
(UNO-SNO only) . . . .. 3208
34 - Tin 200µ"(5.08µm)

Specifications:

  • Inner Contact - BeCu per QQ-C-533
  • Outer Sleeve - Brass per QQ-B-626
  • Insulator - Glass-filled Polyester Rated to UL94V-O
  • Operating Temperature -650C to +1250C
  • Soldering - Wave soldering only (1750C for 15 seconds)
  • PCB Thickness - .062 (1.57) to .125 (3.18)
  • PCB Hole Size - .035 +/- .003 (0.89 +/- 0.08) solder termination
  • All Platings - Over 50 µ" (1.27 µm) minimum Nickel over 5 µ" (0.13 µm) minimum Copper
  • IC Pin Dimension Range - .016 (0.41) to .025 (0.63) round, .125 (3.18) minimum length, .009 (0.23) x .015 (0.38) to .015 (0.38) x .022 (0.56) rectangular
  • Insertion Force - 186 grams
  • Withdrawal Force - 92 grams

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