PGA UX
Glass Epoxy Pin-Grid-Array Sockets
Description
UX
Glass Epoxy Pin Grid Array Socket and Adapter
- Available for all devices.
- Any footprint can be prototyped in less than one week.
- Screw machine contacts feature low insertion and withdrawal force inner clips.
- Options include: Wire-Wrap®, Soldertail, adaptor, surface mount and low-profile options.
Table 1 C : Adapter Terminal Options | |
FIG 1 | FIG.2 |
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PIN TYPE | FIG | A | B | C | D | E | LOOSE PIN NUMBER |
FAA | 1 | .154 (3.92) | .156 (3.95) | .165 (4.20) | .475 (12.07) | .024 (0.62) | 3050 |
FBB | 1 | .154 (3.92) | .156 (3.95) | .124 (3.15) | .434 (11.02) | .019 (0.48) | 3168 |
FCC | 1 | .119 (3.02) | .156 (3.95) | .165 (4.20) | .440 (11.17) | .024 (0.62) | 3155 |
FDD | 1 | .533 (14.05) | .156 (3.95) | .177 (4.50) | .886 (22.50) | .030 (0.76) | 3158 |
BEE | 1 | .120 (3.05) | .156 (3.55) | .093 (2.35) | .352 (8.94) | .020 (0.50) | 3093 |
BFF | 1 | .120 (3.05) | .156 (3.55) | .262 (6.66) | .522 (13.26) | .020 (0.50) | 3094 |
AGG | 1 | .187 (4.75) | .156 (3.95) | .165 (4.20) | .476 (12.10) | .024 (0.62) | 3009 |
FZZ | 1 | .154 (3.92) | .125 (3.18) | .165 (4.20) | .475 (12.07) | .019 (0.48) | 3137 |
DKK | 2 | .335 (8.51) | .125 (3.18) | .125 (3.18) | .585 (14.86) | .019 (0.48) | 80152 |
Style : Leave blank | Style : W |
| See: |
Style : I | |
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ORDERING INFORMATION
U | A | X | C | 14 | 132 | TL | FAA | 72 |
Type | Alternate Footprint | Style | Grid Size | Number of Pins | Plating of Sleeve | Terminal Style | Plating of Inner Contact Blank if adapter | |
U - Open Insulator | Leave Blank for Soldertail | Footprint | GH - Gold 10µ" (0.25µm) | FAA or See Table 1 | 70 - GoId 10µ" (0.25µm) | |||
(Leave Blank for Closed Insulator) | C - Adaptor | TL - Tin Lead 200µ" (5.08µm) | 72 - GoId 30µ" (0.75µm) | |||||
I - SMT | TB - Tin Lead 180µ" (3.80µm) | 74 - Tin 200µ" (5.08µm) | ||||||
L - Low-Profile | TF - Tin d 200µ" (5.08µm) | 74F - Tin 200µ" (5.08µm) with lubricant | ||||||
W - Wire-Wrap® | **22 - Gold 10µ" (0.25µm) | |||||||
| **23 - GoId 30µ" (0.75µm) | ||||||||
Performance Specifications:
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Specifications:
- Inner Contact - BeCu per QQ-C-533
- Outer Sleeve - Brass per QQ-B-626
- Insulator - Glass-filled Epoxy, G-10, FR-4, Rated to UL94V-O
- Operating Temperature - -650C to + 1250C
- Soldering - Wave solder, vapor phase and I.R.
- All Platings - Over 50µ" (1.27 µm) minimum Nickel over 5µ" (0.13µm) minimum Copper
- IC Pin Dimension Range - .016 (0.41) to .025 (0.63) round, .125 (3.18) minimum length, .009 (0.23) x .015 (0.38) to .015 (0.38) x .022 (0.56) rectangular
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