Ball Grid Array Sockets (BGA)

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Precicontact innovations

  • Ultra low floating pin.
  • Progressive Insertion.
  • Low insertion force.
  • Optional : Wave soldering for socket.
  • Optional : No floating pin.
  • Optional : Kapton for BGA adapter

ROWS A ( MM.) A ( Inches ) ROWS A ( MM.) A ( Inches )
7 * 7 11.43 4.50 21 * 21 29.21 11.50
8 * 8 12.70 5.00 22 * 22 30.48 12.00
9 * 9 13.97 5.50 23 * 23 31.75 12.50
10 * 10 15.24 6.00 24 * 24 33.02 13.00
11 * 11 16.51 6.50 25 * 25 34.29 13.50
12 * 12 17.78 7.00 26 * 26 35.56 14.00
13 * 13 19.05 7.50 27 * 27 36.83 14.50
14 * 14 20.32 8.00 28 * 28 38.10 15.00
15 * 15 21.59 8.50 29 * 29 39.37 15.50
16 * 16 22.86 9.00 30 * 30 40.64 16.00
17 * 17 24.13 9.50 31 * 31 41.91 16.50
18 * 18 25.40 10.00 32 * 32 43.18 17.00
19 * 19 26.67 10.50 33 * 33 44.45 17.50
20 * 20 27.94 11.00 34 * 34 45.72 18.00

 

Floating pin: 1.065 mm

No floating pin: 0.720 mm

 

Part Reference Example Details
BGA BALL SOCKET BGA-XX-Y-4-S-2 BGA-2020-272-4S-2 Floating pins
BGA BALL SOCKET BGAM-XX-Y-4-S-2 BGAM-2020-272-4S-2 No floatin pins
BGA PIN SOCKET BGA-XX-Y-4-F-2 BGA-2020-272-4F-2 Socket for wave soldering
BGA ADAPTER BGA-XX-Y-1-A BGA-2020-272-1-A Floating pins
BGA ADAPTER BGA-XX-Y-1-K BGA-2020-272-1-K No floating pins


Rows: XX       Number of pins: Y

 

Standard Requirements :

  • Insulator : Glass-filled Epoxy, FR5, Rated to UL94V-0.
  • Pin male : Gold 5 µ” (0.13 µm).
  • Pin female : Tin 150 µ (3.80 µm).
  • Inner contact : Gold 10 µ” (0.25 µm).

Performance specifications :

  • Insertion force – 35g per contact and progressive insertion.
  • Withdrawal force – 15g per contact.
  • Soldering : solder cream,stencil printer or dispensing, and I.R. furnace.
  • Maximum Operating Current – 1 Ampere per contact.
  • Minimum Durability – 50 cycles.
  • Operating Temperature – 65°C to 125°C.

Others :

  • Grid : .050 ” ( 1.27 mm) or (1.5 mm).
  • For specific socket specifications consult the factory.
  • All BGA footprints available.