PGA IX/IXP

ix-32.jpg

Interstitial PGA Socket

SKU: SKU 4 Category:

IX / IXP

Interstitial Pin Grid Array Socket and Adapter (Glass Epoxy and Molded Plastic Insulator)

  • .100 (2.54) staggered Pin-Grid-Array sockets.
  • Available for the most popular devices.
  • Sockets are molded in hi-temp LCP material and are surface mount compatible.
  • Screw machine contacts feature low insertion and withdrawal force inner contact.
  • Custom footprints and Glass-epoxy insulators available (consult the factory).

 

FIG 1 Soldertail A

FIG 2 Surface Mount

ix-32-1.jpg (27786 octets)

ix-32-2.jpg (21580 octets)

 

ix-32-3.jpg (263058 octets)

 

ix-32-4.jpg (38456 octets)

ORDERING INFORMATION

U

IX

I

P

37

320

TL

A

72

Type

Series

Style

Insulator

Grid Size

Number of pins

Plating of Sleeve

* Terminal Style

Plating of Inner Contact

U – Open Insulator

  

SMT

Molded Plastic

  

Footprint

GH – GoId 10µ” (0.25µm)

See Figure 1 and 2

70 – Gold 10µ” (0.25µm)

(Leave Blank for Closed Insulator)

    

Leave blank for Glass Epoxy

    

TL – Tin Lead 200µ” (5.08µm)

Soldertail Fig 1

72 – GoId 30µ” (0.75µm)
           

TB -Tin Bright (SMT) 150µ”( 3.80µm)

A – .090 (2.29)…90231

74 – Tin 200µ” (5.08µm)
            TF – Tin 200µ” (5.08µm)

B – .120 (3.05)…90238

74F – Tin 200µ” (5.08µm) with lubricant
             

SMT pins Fig 2

**22 – GoId 10µ” (0.25µm)
              A – …. …….90232

**23 – Gold 30µ” (0.75µm)

* Terminal Style :

For Multilayer PCB with thickness more than 1.6 mm use Soldertail B

For Soldertail B : 090 (2.29) just become .120 (3.05) on Fig 1

 

Performance Specifications :

  • Minimum Durability – 50 cycles
  • With .0180 (0.457)Æ Spherical Radius Pin :
  • Insertion Force – 43g per contact
  • Withdrawal Force – 23g per contact
  • **Special Ultra Low Insertion Force Clip
  • **Insertion Force – 22g per contact
  • **Withdrawal Force – 10g per contact
  • Maximum Operating Current – 1 Ampere per Contact
  • Dielectric Withstanding Voltage – 1000V RMS for 1 Minute
  • Minimum Insulation Resistance – 5000 Megohms
  • Pin-to-Pin Capacitance – <0.4pf
  • Contact Resistance – <20mW

 

Specifications :

  • Inner Contact – BeCu per QQ-C-533
  • Outer Sleeve – Brass per QQ-B-626
  • Insulator (Molded) – Liquid Crystal Polymer (LCP) Rated to UL94V-O, color black
  • Insulator – (Glass Epoxy) – G-10, FR-4, Rated to UL94V-O
  • Operating Temperature – -650 C to + 1250 C
  • Soldering – lnfared Reflow: 2300 C, duration 15 seconds (2600 C max.)
  • All Platings – Over 50µ” (1.27µm) Nickel over 5µ” (0.13µm) minimum Copper
  • IC Pin Dimension Range – .016 (.041) to .025 (.063) round, .125 (3.18) minimum length

 

 

 

 

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