PGA UXP

uxp-30.jpg

Molded Pin-Grid-Array Sockets

SKU: SKU 1 Category:

UXP

Molded Pin Grid Array Socket and Adapter

  • Available for the most popular devices.
  • Sockets are molded in Hi-temp PPS material and are surface mount compatible.
  • Screw machine contacts feature low insertion and withdrawal force inner clips.
  • Options include: molded stand-offs, wire-wrap®, soldertail, adaptor, surface-mount and low-profile termination options.

 

Table 1 C : Adapter Terminal Options

FIG 1

FIG.2

usc-95-1

usc-95-2.jpg (27562 octets)

 

PIN TYPE

FIG

A

B

C

D

E

LOOSE PIN NUMBER

 

FAA

1

.154 (3.92)

.156 (3.95)

.165 (4.20)

.475 (12.07)

.024 (0.62)

3050

FBB

1

.154 (3.92)

.156 (3.95)

.124 (3.15)

.434 (11.02)

.019 (0.48)

3168

FCC

1

.119 (3.02)

.156 (3.95)

.165 (4.20)

.440 (11.17)

.024 (0.62)

3155

FDD

1

.533 (14.05)

.156 (3.95)

.177 (4.50)

.886 (22.50)

.030 (0.76)

3158

BEE

1

.120 (3.05)

.156 (3.55)

.093 (2.35)

.352 (8.94)

.020 (0.50)

3093

BFF

1

.120 (3.05)

.156 (3.55)

.262 (6.66)

.522 (13.26)

.020 (0.50)

3094

AGG

1

.187 (4.75)

.156 (3.95)

.165 (4.20)

.476 (12.10)

.024 (0.62)

3009

FZZ

1

.154 (3.92)

.125 (3.18)

.165 (4.20)

.475 (12.07)

.019 (0.48)

3137

DKK

2

.335 (8.51)

.125 (3.18)

.125 (3.18)

.585 (14.86)

.019 (0.48)

80152

 

Style : Leave blank

Style : W

ux-28-1.jpg (48249 octets)

 PINS 3001-2: E=.360 (9.15)

 PINS 3001-3: E= .500 (12.70)

Style : I

Style : L

ux-28-4.jpg (34330 octets)

ux-28-5.jpg (36278 octets)

 ORDERING INFORMATION

U

A

X

C

P

14

132

TL

A

72

Type

Alternate Footprint

Style

  

Grid Size

Number of Pins

Plating of Sleeve

Terminal Style

Plating of Inner Contact Blank if adapter

U – Open Insulator

    

Leave Blank for Soldertail

     Footprint

GH – Gold 10µ” (0.25µm)

A or See Table 1

70 – GoId 10µ” (0.25µm)

(Leave Blank for Closed Insulator)

    

C – Adaptor

       TL – Tin Lead 200µ” (5.08µm)  

72 – GoId 30µ” (0.75µm)
     

I – SMT

       TB – Tin Lead 180µ” (3.80µm)   74 – Tin 200µ” (5.08µm)
     

L – Low-Profile

       TF – Tin 200µ” (5.08µm)  

74F – Tin 200µ” (5.08µm) with lubricant
     

W – Wire-Wrap®

          

**22 – Gold 10µ” (0.25µm)
                  **23 – GoId 30µ” (0.75µm)

 

 Performance specifications:

  • Minimum Duability – 50 cycles
  • Insertion Force – 43g per contact*
  • Withdrawal Force – 23g per contact*
  • **Insertion Force – 22g per contact*
  • **Withdrawal Force – 10g per contact*
  • Maximum Operating Current – 1 Ampere per contact
  • Dielectric Withstanding Voltage – 1000V RMS for 1 Minute
  • Minimum Insulation Resistance – 5000 megohms
  • Pin-to-Pin Capacitance – <0.4pf
  • Contact Resistance – <0.4mW
  • *With .0180 (0.457) Æ Spherical Radius Pin
  • **Special Ultra Low Insertion Force Clip
 uxp-31.jpg (46915 octets)

 

Specifications:

  • Inner Contact – BeCu per QQ-C-533
  • Outer Sleeve – Brass per QQ-B-626
  • Insulator – PPS (Ryton TM), Polyphenylene Sulfide Rated to UL94V-O
  • Operating Temperature – -650C to + 1250C
  • All Platings – Over 50µ” (1.27µm) Nickel over 5µ” (0.13µm) Copper
  • Soldering – Infared reflow: 2300C, duration 15 seconds (2600 C max)
  • IC Pin Dimension Range – .016 (0.41) to .025 (0.63) round, .125 (3.18) minimum length

Related products