ISO
Shrink-Dip Socket .70 (1.78)
Shrink-Dip Socket .70 (1.78) Pitch
- Shrink-DIP sockets .070 (1.78) spacing between contacts.
- Insulator – Glass Epoxy, UL94V-0
- Open insulator with ladder construction.
- Machined outer sleeve with BeCu inner contact.
- Socket pins feature closed-end construction eliminating any solder wicking problems.
|
Standard Parts |
DIMENSIONS (See Fig. 1) |
||||
|
PART NUMBER |
NUMBER OF PINS |
A |
B |
C |
D |
| ISO9440028XXXXX | 28 | .980 (24.89) | .500 (12.70) | .400 (10.16) | .094 (2.39) |
| ISO9460042XXXXX | 42 | 1.470 (37.34) | .700 (17.78) | .600 (15.24) | .094 (2.39) |
| ISO9475064XXXXX | 64 | 2.240 (56.90) | .850 (21.59) | .750 (19.05) | .094 (2.39) |
| FIG 1 |
|
|
ORDERING INFORMATION
|
ISO |
94 |
75 |
064 |
TL |
A |
72 |
|
Series |
Thickness of Insulator |
DIP Spacing |
Number of Pins |
Plating of Sleeve |
Solder Tail Corresponding |
Plating of Inner Contact |
|
ISO |
94 – .094 (2.39) |
75 |
042 |
TL – Tin Lead 200µ” (5.08µm) |
Length Loose see Fig 1 |
30 – Gold 10µ” (0.25µm) |
|
60 |
064 |
GH – GoId 10µ” (0.25µm) |
E Dim……….Pin Number |
31 – GoId 30µ” (0.75µm) |
||
|
40 |
TF – Tin 200µ” (5.08µm) |
A – .118 (3.00) . . . 3164 |
Specifications:
- Inner Contact – BeCu per QQ-C-533
- Outer Sleeve – Brass per QQ-B-626
- Insulator – Glass Epoxy, G-10, FR-4 Rated to UL94V-O
- Operating Temperature – -650C to +1250C
- Soldering – Wave soldering only (1 750C for 15 seconds)
- PCB Thickness – .062 (1.57) to .125 (3.18)
- PCB Hole Size – .035 +/- .003 (0.89 +/- 0.08) solder termination
- All Platings – Over 50 µ” (1.27 µm) minimum Nickel over 5 µ” (013 µm) minimum Copper
- IC Pin Dimension Range – .016 (0.41) to .025 (0.63) round, .125 (3.18) minimum length,
- .009 (0.23) x .015 (0.38) to .015 (0.38) x .022 (0.56) rectangular
- Insertion Force – 186 grams
- Withdrawal Force – 92 grams
- Other : Customs available.
